GRANT(PI & MEMBERS)
4
PUBLICATIONS
4
INDEXED PUBLICATION
2
TOTAL STUDENTS
H-INDEXED (SCOPUS)
CITATIONS (SCOPUS)
Grant (PI)
TOTAL
Publications
INDEXED PUBLICATION
2
NON-INDEXED PUBLICATION
0
OTHERS PUBLICATION
2
TOTAL
Supervisions
MASTER
0
PHD
0
TOTAL
Legend : SPONSOR TYPE OF GRANT
| Grant Name | Year |
|---|---|
| DEVELOPMENT A NEW FORMULATION OF SUSTAINABLE INTELLIGENT FLUID FOR MALAYSIAN VEHICLE SEMI ACTIVE SUSPENSION SYSTEM RUG OF UTM Tier 1 |
2018 |
| Novel Fabrication Method for High Quality Aluminium Nitride Thin Films RUG OF UTM Tier 2 |
2017 |
| Mechanism of Formation and Annihilation of Lattice Defects in Nitride Semiconductor Thin Films with a Non-Polar Crystallographic Orientation MINISTRY OF EDUCATION Fundamental Research Grant Scheme |
2013 |
| Exploratory Research On Improvement In Lead-Free Solder Materials For Mitigation Of Whisker Formation MINISTRY OF EDUCATION Exploratory Research Grant Scheme |
2013 |
Legend : PUBLICATION CATEGORY TYPE OF AUTHORS
| Publication Name | Year |
|---|---|
|
Preliminary Study On Deformation And Recrystallization Behavior Of Pure Tin For Mitigation Of Whisker Growth
SOLID STATE PHENOMENA Publication In Scopus CO-AUTHOR |
2018 |
|
Preliminary Study On Deformation And Recrystalization Behavior Of Pure Tin For Mitigation Of Whisker Growth
ELECTRONIC PACKAGING INTERCONNECT TECHNOLOGY SYMPOSIUM 2017 Conference Paper CO-AUTHOR |
2017 |
|
Electron Microscopy Study Of Grain Boundary Behavior In Pb-Free Solder Materials For Mitigation Of Whiskers
MATERIALS SCIENCE FORUM Publication In Scopus CO-AUTHOR |
2015 |
|
Electron Microscpy Study Of Deformation And Recrystallization
Behavior Of Pure Tin For Mitigation Of Whiskers
MALASIA-JAPAN JOINT INTERNATIONAL CONFERENCE Conference Paper UTM FIRST AUTHOR |
2015 |
Legend : IP CATEGORY IP LEVEL
| Intellectual Property Name | Grant Register No. | IP Level | IP Category |
|---|
Legend : SESSION LEVEL OF STUDY STATUS SUPERVISION LEVEL
| Supervision List |
|---|